“Mentor, a Siemens business, today announced that the Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platform have been certified by TSMC’s 7nm FinFET Plus and the latest version of the 5nm FinFET process. In addition, Mentor continues to expand the capabilities of the Xpedition™ Package Designer and Xpedition Substrate Integrator products to support TSMC’s advanced packaging products.
Mentor, a Siemens business, announced today that the Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platform have been certified by TSMC for its 7nm FinFET Plus and the latest version of its 5nm FinFET process. In addition, Mentor continues to extend the capabilities of the Xpedition™ Package Designer and Xpedition Substrate Integrator products to support TSMC’s advanced packaging products.
Suk Lee, Senior Director, Design Infrastructure Marketing, TSMC, said: “TSMC has worked closely with Mentor, who continues to increase its support for TSMC by providing additional capabilities for its EDA solutions to support our new 5nm and 7nm FinFET Plus processes. The value of the ecosystem. Mentor has been our strategic partner for many years, Siemens will continue to make strategic investments in Mentor’s Electronic design automation (EDA) technology, they are helping mutual customers to achieve greater success, to market Introducing a new generation of amazing IC innovations.”
Mentor Calibre nmPlatform for TSMC 5nm and 7nm FinFET Plus
Mentor has enhanced the Calibre nmDRC™ and Calibre nmLVS™ tools for TSMC’s 7nm FinFET Plus process and the latest version of the 5nm FinFET process. Mentor will continue to provide TSMC customers with the functionality and performance they need to achieve their manufacturing requirements. The Calibre nmDRC and Calibre nmLVS tools are cloud-ready products and are currently deployed in server solutions with thousands of CPUs by many customers.
Mentor’s Caliber YieldEnhancer tool has been certified for use on TSMC’s 5nm and 7nm FinFET Plus processes. Mentor and TSMC have developed unique fill rules to meet manufacturing requirements by tightly controlling the placement of fill shapes. The capabilities of the Calibre YieldEnhancer tool combined with TSMC’s Calibre Fill Design Kit maximizes virtual metal insertion rates.”
Not only is the Calibre PERC™ reliability platform certified for TSMC’s 5nm and 7nm FinFET Plus processes, it also features TSMC-developed and newly enhanced PERC constraint checking capabilities that help TSMC’s customers improve the reliability of their designs.
Mentor Enhances Tool Capabilities to Support TSMC’s InFO_MS Stacking Technology
Mentor has further enhanced its toolset to support TSMC’s InFO_MS (Integrated Fan-Out with Substrate Memory) advanced package-on-package product. In addition to the ability to create and manage complex component connections and serve as a key automation tool for interfacing with Xpedition Package Designer for layout, Mentor’s Xpedition Substrate Integrator is extended to automate source netlist generation for running Calibre 3DSTACK Do a connection check. Calibre 3DSTACK™ for LVS, Calibre nmDRC, Calibre xACT for interface coupling capacitance extraction, and Calibre PERC tools for peer-to-peer (P2P) inspection are also included in TSMC’s InFO_MS reference flow. These enhancements provide a comprehensive implementation and verification solution for the TSMC InFO_MS design flow.
Mentor AFS Platform for TSMC 5nm FinFET and 7nm FinFET Plus
The AFS platform includes the AFS Mega circuit emulator, certified and available for TSMC’s 7nm FinFET Plus process and the latest version of the 5nm FinFET process. Analog, mixed-signal, and radio frequency (RF) design teams at the world’s leading semiconductor companies benefit from using the AFS platform to validate chips using the latest TSMC technology.
“Mentor is proud to partner with TSMC to continue delivering key technologies that allow our customers to bring IC innovations to market faster,” said Joe Sawicki, executive vice president of Mentor’s IC division. “This year, TSMC and Mentor have teamed up to deliver a number of solutions. , providing our mutual customers with an increasing number of design avenues to rapidly deliver IC products for the mobile, HPC, automotive, AI and IoT/wearable markets. “